LERAMELT Postforming Glue is a water based PVAc. glue that is used to bond laminate papers to MDF or Chipboards. It is also used for postforming applications and very suitable for high temperature applications. It is highly resistant to different sources of temperature and will not debond even in risky applications. It does highly resistant to physical effects.
- Glue is used to bond HPL and CPL laminaton papers under high heat to MDF, chipboard and solid wood.
- Suitable for roller press applications.